Business 2.5D package design tools available from GloFo, Amkor and Open-Silicon
2013/11/22GloFo, Open-Silicon and Amkor have come up with a functional 2.5D package test vehicle and the design tools, PDK, design rules, and supply chain are now in place and proven for interposer products from all three companies.
The jointly developed test vehicle has two ARM Cortex-A9 processors fabbed on GloFo’s 28nm-SLP attached to a silicon interposer, which is built on a 65nm manufacturing flow with TSVs to enable high-bandwidth communication between the chips.
Open-Silicon provided the processor, interposer, substrate, and test design, as well as the test and characterization of the final product.
GloFo provided the PDKs, interposer reference flow and manufactured both the 28nm ARM processors and the 65nm silicon interposer with embedded TSVs.
Amkor provided the package-related design rules and manufacturing processes for back-side integration, copper pillar micro-bumping, and 2.5D product assembly.
GLoFo and Amkor collaborated closely throughout the project to develop and validate the design rules, assembly processes, and required material sets.
The companies demonstrated first-time functionality of the processor, interposer, and substrate designs, and the die-to-substrate (D2S) process used by the supply chain resulted in high yields.
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